XCVC1802-1MLIVSVD1760
AMD Xilinx
XCVC1802-1MLIVSVD1760
AMD Xilinx
IC VERSAL AICORE FPGA 1760BGA
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XCVC1802-1MLIVSVD1760
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Product details
AMD Xilinx's XCVC1802-1MLIVSVD1760 redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making XCVC1802-1MLIVSVD1760 the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MPU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.With 256KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DDR, DMA, PCIe include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 600MHz, 1.3GHz, the processor meets the real-time requirements of high-channel-count audio systems.Versal™ AI Core FPGA, 1.5M Logic Cells include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for -40°C ~ 100°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 1760-BFBGA, FCBGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 1760-FCBGA (40x40), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.3GHz
- Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BFBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (40x40)
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