M2S050TS-FGG896
Microchip Technology
M2S050TS-FGG896
Microchip Technology
IC SOC CORTEX-M3 166MHZ 896FBGA
Reference Price (USD)
1+
$195.05074
500+
$193.1002326
1000+
$191.1497252
1500+
$189.1992178
2000+
$187.2487104
2500+
$185.298203
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M2S050TS-FGG896
$195.05
Product details
The M2S050TS-FGG896 by Microchip Technology is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The ARM® Cortex®-M3 core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.256KB of flash memory provides sufficient storage for machine learning models and over-the-air update capabilities in remote deployments.With 64KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DDR, PCIe, SERDES include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The CANbus, Ethernet, I²C, SPI, UART/USART, USB options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 166MHz, the processor balances performance with power efficiency for always-on sensing applications.FPGA - 50K Logic Modules feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for 0°C ~ 85°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 896-BGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 896-FBGA (31x31), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 50K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BGA
- Supplier Device Package: 896-FBGA (31x31)
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