XCVM1802-1LSIVSVD1760
AMD Xilinx
XCVM1802-1LSIVSVD1760
AMD Xilinx
IC VERSAL AICORE FPGA 1760BGA
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XCVM1802-1LSIVSVD1760
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Product details
The XCVM1802-1LSIVSVD1760 from AMD Xilinx delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making XCVM1802-1LSIVSVD1760 particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MPU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DDR, DMA, PCIe include high-resolution PWM generators and isolated voltage/current sensing interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 400MHz, 1GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Versal™ Prime FPGA, 1.9M Logic Cells include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for -40°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 1760-BFBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 1760-FCBGA (40x40), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 400MHz, 1GHz
- Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BFBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (40x40)
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