XU210-512-FB236-C20
XMOS
XU210-512-FB236-C20
XMOS
IC MCU 32BIT ROMLESS 236FBGA
Reference Price (USD)
1+
$16.12071
500+
$15.9595029
1000+
$15.7982958
1500+
$15.6370887
2000+
$15.4758816
2500+
$15.3146745
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XU210-512-FB236-C20
$16.12
Product details
XMOS's XU210-512-FB236-C20 delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The XCore core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 32-Bit 10-Core architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 2000MIPS, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.The USB interfaces implement Manchester encoding for noise-immune data transmission, ensuring reliable communication in high-EMI environments like radar installations.With 104 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.The ROMless implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.512K x 8 of scrubable memory prevents accumulation of single-event upsets, maintaining data integrity during extended missions in high-radiation orbits.The 0.95V ~ 3.6V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.The External clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for 0°C ~ 70°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Surface Mount packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 236-LFBGA format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 236-FBGA (10x10), the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.
Product Attributes
- Product Status: Active
- Core Processor: XCore
- Core Size: 32-Bit 10-Core
- Speed: 2000MIPS
- Connectivity: USB
- Peripherals: -
- Number of I/O: 104
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 236-LFBGA
- Supplier Device Package: 236-FBGA (10x10)
You May Also Be Interested In
