PIC16C57-XTI/SP
Microchip Technology
PIC16C57-XTI/SP
Microchip Technology
IC MCU 8BIT 3KB OTP 28SPDIP
Reference Price (USD)
1+
$7.30495
500+
$7.2319005
1000+
$7.158851
1500+
$7.0858015
2000+
$7.012752
2500+
$6.9397025
Exquisite packaging
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PIC16C57-XTI/SP
$7.30
Product details
Microchip Technology's PIC16C57-XTI/SP delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The PIC core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 8-Bit architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 4MHz, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.POR, WDT include radiation-hardened timers and watchdog circuits that automatically recover from single-event functional interrupts within 10 s.With 20 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.3KB (2K x 12) of TMR-protected storage accommodates flight control algorithms with full error detection and correction capabilities.The OTP implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.72 x 8 of scrubable memory prevents accumulation of single-event upsets, maintaining data integrity during extended missions in high-radiation orbits.The 3V ~ 6.25V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.The External clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for -40°C ~ 85°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Through Hole packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 28-DIP (0.300", 7.62mm) format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 28-SPDIP, the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.
Product Attributes
- Product Status: Active
- Core Processor: PIC
- Core Size: 8-Bit
- Speed: 4MHz
- Connectivity: -
- Peripherals: POR, WDT
- Number of I/O: 20
- Program Memory Size: 3KB (2K x 12)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 72 x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 6.25V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Through Hole
- Package / Case: 28-DIP (0.300", 7.62mm)
- Supplier Device Package: 28-SPDIP
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