XCZU1CG-L2SFVC784E
AMD Xilinx
XCZU1CG-L2SFVC784E
AMD Xilinx
IC ZUP MPSOC LP A53 FPGA 784BGA
Reference Price (USD)
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$372.69000
500+
$368.9631
1000+
$365.2362
1500+
$361.5093
2000+
$357.7824
2500+
$354.0555
Exquisite packaging
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XCZU1CG-L2SFVC784E
$372.69
Product details
AMD Xilinx's XCZU1CG-L2SFVC784E sets new standards in Embedded - System On Chip (SoC) technology, optimized for industrial automation systems demanding uncompromising reliability. This SoC combines robust electromagnetic compatibility with precise voltage regulation, delivering exceptional performance in harsh manufacturing environments where XCZU1CG-L2SFVC784E excels in noise immunity and long-term stability.The innovative MPU, FPGA architecture incorporates redundant processing elements that provide fault-tolerant operation crucial for safety-critical applications.Powered by the Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, the device achieves industry-leading deterministic response times while maintaining ultra-low power consumption during idle states.With 256KB of error-correcting RAM, the processor ensures data integrity in high-vibration environments typical of factory automation equipment.The rich set of DMA, WDT enables direct sensor interfacing without additional signal conditioning circuits, simplifying system design while improving measurement accuracy.The 533MHz, 1.333GHz operating frequency provides sufficient headroom for complex control algorithms while maintaining precise synchronization across distributed systems.Designed for 0°C ~ 100°C (TJ) operation, the component withstands thermal cycling stresses encountered in outdoor industrial installations.The rugged 784-BFBGA, FCBGA construction ensures mechanical stability in high-shock environments while maintaining excellent thermal conductivity.The 784-FCBGA (23x23) format enables cost-effective manufacturing while meeting stringent industrial certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: -
- Speed: 533MHz, 1.333GHz
- Primary Attributes: -
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 784-BFBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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