10AS016E3F27E2SG
Intel
10AS016E3F27E2SG
Intel
IC SOC CORTEX-A9 1.5GHZ 672FBGA
Reference Price (USD)
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$817.08000
500+
$808.9092
1000+
$800.7384
1500+
$792.5676
2000+
$784.3968
2500+
$776.226
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10AS016E3F27E2SG
$817.08
Product details
The 10AS016E3F27E2SG from Intel delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making 10AS016E3F27E2SG particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MCU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA, POR, WDT include high-resolution PWM generators and isolated voltage/current sensing interfaces.The EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 1.5GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.FPGA - 160K Logic Elements include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for 0°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 672-BBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 672-FBGA, FC (27x27), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 1.5GHz
- Primary Attributes: FPGA - 160K Logic Elements
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA, FC (27x27)
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