XCZU1CG-L1SFVA625I
AMD Xilinx
XCZU1CG-L1SFVA625I
AMD Xilinx
IC ZUP MPSOC LP A53 FPGA 625BGA
Reference Price (USD)
1+
$317.34000
500+
$314.1666
1000+
$310.9932
1500+
$307.8198
2000+
$304.6464
2500+
$301.473
Exquisite packaging
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XCZU1CG-L1SFVA625I
$317.34
Product details
AMD Xilinx's XCZU1CG-L1SFVA625I sets new standards in Embedded - System On Chip (SoC) technology, optimized for industrial automation systems demanding uncompromising reliability. This SoC combines robust electromagnetic compatibility with precise voltage regulation, delivering exceptional performance in harsh manufacturing environments where XCZU1CG-L1SFVA625I excels in noise immunity and long-term stability.The innovative MPU, FPGA architecture incorporates redundant processing elements that provide fault-tolerant operation crucial for safety-critical applications.Powered by the Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, the device achieves industry-leading deterministic response times while maintaining ultra-low power consumption during idle states.With 256KB of error-correcting RAM, the processor ensures data integrity in high-vibration environments typical of factory automation equipment.The rich set of DMA, WDT enables direct sensor interfacing without additional signal conditioning circuits, simplifying system design while improving measurement accuracy.The 500MHz, 1.2GHz operating frequency provides sufficient headroom for complex control algorithms while maintaining precise synchronization across distributed systems.Designed for -40°C ~ 100°C (TJ) operation, the component withstands thermal cycling stresses encountered in outdoor industrial installations.The rugged 625-BFBGA, FCBGA construction ensures mechanical stability in high-shock environments while maintaining excellent thermal conductivity.The 625-FCBGA (21x21) format enables cost-effective manufacturing while meeting stringent industrial certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: -
- Speed: 500MHz, 1.2GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)
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