XCVM1802-2LSEVSVD1760
AMD Xilinx
XCVM1802-2LSEVSVD1760
AMD Xilinx
IC VERSAL AICORE FPGA 1760BGA
Reference Price (USD)
1+
$13084.74000
500+
$12953.8926
1000+
$12823.0452
1500+
$12692.1978
2000+
$12561.3504
2500+
$12430.503
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XCVM1802-2LSEVSVD1760
$13,084.74
Product details
AMD Xilinx's XCVM1802-2LSEVSVD1760 sets a new benchmark in Embedded - System On Chip (SoC) for high-speed data acquisition systems. Optimized for test and measurement equipment, this SoC delivers unparalleled analog-to-digital conversion performance while maintaining exceptional signal integrity for precision instrumentation applications.The MPU, FPGA architecture incorporates parallel processing pipelines that achieve real-time data analysis with minimal latency for oscilloscopes and spectrum analyzers.Powered by the Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, the device handles complex waveform processing while maintaining precise timing synchronization across multiple channels.With 256KB of high-bandwidth RAM, the processor enables deep capture buffers for transient signal analysis.The DDR, DMA, PCIe include multi-gigasample ADCs and programmable gain amplifiers that enhance measurement accuracy.High-speed CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces ensure seamless data transfer to host systems for real-time visualization and processing.Operating at 450MHz, 1.08GHz, the processor meets the stringent timing requirements of high-resolution data acquisition systems.Versal™ Prime FPGA, 1.9M Logic Cells provide hardware-based triggering and windowing functions that accelerate measurement workflows.Designed for 0°C ~ 100°C (TJ) operation, the component maintains calibration accuracy across environmental variations.The 1760-BFBGA, FCBGA package offers excellent signal isolation and thermal stability for precision measurement applications.Available in 1760-FCBGA (40x40), the device meets the reliability requirements of professional test equipment.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 450MHz, 1.08GHz
- Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BFBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (40x40)
You May Also Be Interested In
