M2S090T-1FGG676
Microchip Technology
M2S090T-1FGG676
Microchip Technology
IC SOC CORTEX-M3 166MHZ 676FBGA
Reference Price (USD)
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$315.20200
500+
$312.04998
1000+
$308.89796
1500+
$305.74594
2000+
$302.59392
2500+
$299.4419
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M2S090T-1FGG676
$315.20
Product details
Microchip Technology's M2S090T-1FGG676 redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making M2S090T-1FGG676 the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MCU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The ARM® Cortex®-M3 core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.512KB of low-latency flash memory stores extensive effect presets and configuration profiles.With 64KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DDR, PCIe, SERDES include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The CANbus, Ethernet, I²C, SPI, UART/USART, USB suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 166MHz, the processor meets the real-time requirements of high-channel-count audio systems.FPGA - 90K Logic Modules include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for 0°C ~ 85°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 676-BGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 676-FBGA (27x27), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
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