XC7Z030-2FBG676I
AMD Xilinx
XC7Z030-2FBG676I
AMD Xilinx
IC SOC CORTEX-A9 800MHZ 676FCBGA
Reference Price (USD)
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$417.30000
500+
$413.127
1000+
$408.954
1500+
$404.781
2000+
$400.608
2500+
$396.435
Exquisite packaging
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XC7Z030-2FBG676I
$417.30
Product details
AMD Xilinx's XC7Z030-2FBG676I sets a new benchmark in Embedded - System On Chip (SoC) for high-speed data acquisition systems. Optimized for test and measurement equipment, this SoC delivers unparalleled analog-to-digital conversion performance while maintaining exceptional signal integrity for precision instrumentation applications.The MCU, FPGA architecture incorporates parallel processing pipelines that achieve real-time data analysis with minimal latency for oscilloscopes and spectrum analyzers.Powered by the Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, the device handles complex waveform processing while maintaining precise timing synchronization across multiple channels.With 256KB of high-bandwidth RAM, the processor enables deep capture buffers for transient signal analysis.The DMA include multi-gigasample ADCs and programmable gain amplifiers that enhance measurement accuracy.High-speed CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interfaces ensure seamless data transfer to host systems for real-time visualization and processing.Operating at 800MHz, the processor meets the stringent timing requirements of high-resolution data acquisition systems.Kintex™-7 FPGA, 125K Logic Cells provide hardware-based triggering and windowing functions that accelerate measurement workflows.Designed for -40°C ~ 100°C (TJ) operation, the component maintains calibration accuracy across environmental variations.The 676-BBGA, FCBGA package offers excellent signal isolation and thermal stability for precision measurement applications.Available in 676-FCBGA (27x27), the device meets the reliability requirements of professional test equipment.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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