XCVM1802-2MLIVSVD1760
AMD Xilinx
XCVM1802-2MLIVSVD1760
AMD Xilinx
IC VERSAL AICORE FPGA 1760BGA
Reference Price (USD)
1+
$16355.31000
500+
$16191.7569
1000+
$16028.2038
1500+
$15864.6507
2000+
$15701.0976
2500+
$15537.5445
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XCVM1802-2MLIVSVD1760
$16,355.31
Product details
Engineered for next-generation consumer electronics, AMD Xilinx's XCVM1802-2MLIVSVD1760 revolutionizes Embedded - System On Chip (SoC) performance in smart home devices. This advanced SoC combines powerful processing with intuitive user interfaces, making XCVM1802-2MLIVSVD1760 ideal for voice-controlled assistants where audio signal processing and low-latency response are critical.The multi-core MPU, FPGA architecture enables simultaneous voice recognition, natural language processing, and wireless communication tasks.Featuring the Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, the device delivers the computational power needed for real-time audio beamforming and noise cancellation algorithms.With 256KB of low-latency RAM, the processor ensures smooth performance during complex voice interaction scenarios.Consumer-focused DDR, DMA, PCIe include high-fidelity audio interfaces and touch controllers for seamless user experiences.The comprehensive CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major smart home protocols while maintaining robust wireless performance.Operating at 600MHz, 1.4GHz, the processor meets the real-time requirements of always-listening voice interfaces.Versal™ Prime FPGA, 1.9M Logic Cells include hardware-accelerated neural network processing for on-device AI capabilities.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in various home environments.The 1760-BFBGA, FCBGA package enables sleek, compact designs without compromising thermal performance.Available in 1760-FCBGA (40x40), the device supports high-volume consumer electronics manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 600MHz, 1.4GHz
- Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BFBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (40x40)
You May Also Be Interested In
