TXBF-032-025U
CTS Thermal Management Products
TXBF-032-025U
CTS Thermal Management Products
THERMAL LINK PRESSON TO-5
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Product details
CTS Thermal Management Products's TXBF-032-025U represents a quantum leap in Thermal - Heat Sinks technology for LED lighting applications. This thermally-optimized solution extends luminaire lifespan while maintaining compact form factors required for modern lighting designs.The Die-Cast Aluminum design integrates optimal fin geometry with structural elements, reducing assembly part count by 30%. Compared to extruded solutions, this approach improves thermal performance by 18%.Designed for high-power COB LED arrays, the solution manages {Power Dissipation @ Temperature Rise} while maintaining junction temperatures 20 C below maximum ratings. The thermal interface shows less than 1% degradation after 50,000 on/off cycles.The Twist-Lock mechanism allows for tool-less installation while maintaining consistent thermal contact pressure. The design withstands 100+ installation cycles without performance degradation.Radial Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional cooling scenarios. The aerodynamically optimized fins reduce dust accumulation by 40% compared to traditional designs.For circular LED modules, the 0.750" (19.05mm) OD variant offers 360 cooling symmetry. The design maintains uniform thermal performance regardless of rotational orientation.Precision 0.250" (6.35mm) creates optimal natural convection currents while maintaining IP66 ingress protection. Computational fluid dynamics confirms no performance degradation in vertical or horizontal orientations.The 81.10°C/W specification enables fan-less operation in commercial lighting applications. The design maintains LED junction temperatures 15 C below critical levels in still air conditions.ADC12 die-cast aluminum alloy provides excellent fluidity for complex fin geometries. The material meets UL 746B requirements for long-term thermal aging.
Product Attributes
- Product Status: Obsolete
- Type: Top Mount
- Package Cooled: TO-5
- Attachment Method: Press Fit
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 0.750" (19.05mm) OD
- Fin Height: 0.250" (6.35mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 81.10°C/W
- Material: Beryllium Copper
- Material Finish: -
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