TXBF-019-025B
CTS Thermal Management Products
TXBF-019-025B
CTS Thermal Management Products
THERMAL LINK PRESSON TO-18
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Product details
The TXBF-019-025B from CTS Thermal Management Products sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.The Pressure-Sensitive Adhesive system allows for tool-less installation with consistent bond strength (3-5N/cm ). The adhesive maintains performance across -20 C to +85 C operating range.Micro-Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in ultra-thin airflow channels. The 0.3mm fin pitch creates optimal boundary layer disruption for maximum heat transfer.For cylindrical battery cells, the 0.500" (12.70mm) OD variant provides 180 cooling coverage. The design maintains thermal contact during typical device flexing (up to 5 bend angle).Precision 0.250" (6.35mm) of just 0.5mm enables integration in sub-8mm device profiles. The nanostructured surface enhances heat transfer coefficient by 15%.The 150.00°C/W specification enables passive cooling in standby modes. The design maintains surface temperatures below 45 C in still air conditions.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.Black PVD coating ensures aesthetic consistency with consumer electronics while improving radiative cooling. The finish meets MIL-STD-810G abrasion resistance requirements.
Product Attributes
- Product Status: Obsolete
- Type: Top Mount
- Package Cooled: TO-18
- Attachment Method: Press Fit
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 0.500" (12.70mm) OD
- Fin Height: 0.250" (6.35mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 150.00°C/W
- Material: Beryllium Copper
- Material Finish: Black Cadmium
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