TH930-50G-4JAR

The TH930-50G-4JAR from Penchem Technologies Sdn Bhd represents a technological leap in Thermal - Adhesives, Epoxies, Greases, Pastes, specifically formulated for next-generation thermal management solutions. This high-performance material combines exceptional thermal transfer capabilities with outstanding reliability for mission-critical applications.This Silicone Putty thermal interface material incorporates advanced polymer technology. Unlike conventional compounds, its viscoelastic properties adapt to thermal expansion differentials, maintaining optimal interface pressure throughout {Usable Temperature Range}.The 50 gram Jar packaging options cater to diverse manufacturing needs. Precision-engineered containers ensure consistent material properties from first to last use, reducing application variability.Engineered for -76°F ~ 392°F (-60°C ~ 200°C) operation, this material demonstrates exceptional stability. Testing shows less than 3% thermal resistance variation after 1000 cycles, making it ideal for industrial automation systems.White coloration provides immediate visual confirmation of proper application. This quality assurance feature is particularly valuable in high-reliability applications where inspection access is limited.Delivering 5.00W/m-K thermal conductivity, this compound outperforms standard materials by 30-35%. Its optimized filler distribution creates efficient thermal pathways without compromising dielectric strength.With 18 Months shelf life, this product reduces material waste and inventory costs. Proper storage at {Storage/Refrigeration Temperature} maintains the compound's original performance characteristics.