TC4-20G

The TC4-20G by Chip Quik Inc. revolutionizes Thermal - Adhesives, Epoxies, Greases, Pastes applications through its scientifically formulated thermal management properties. Optimized for high-reliability systems, this material delivers unparalleled thermal transfer efficiency while simplifying manufacturing processes.This Silicone Compound thermal interface material incorporates nanotechnology-enhanced fillers. Compared to conventional formulations, it provides 25% better surface conformity while requiring 40% less application pressure for optimal bonding.Packaged in 20 gram Syringe quantities, this product accommodates diverse production scales. The ergonomic container design facilitates both manual application and automated dispensing systems.Performance remains stable across -40°F ~ 302°F (-40°C ~ 150°C), making it ideal for automotive under-hood applications. The material's thermal resistance coefficient shows less than 5% variation throughout this spectrum.The Silver hue serves multiple purposes: application verification and UV degradation monitoring. This dual-function pigmentation system enhances quality control in outdoor electronics applications.Achieving 79.00 W/m-K thermal conductivity, this material reduces thermal interface resistance by up to 35%. Its optimized particle distribution creates efficient heat transfer pathways without increasing mechanical stress.With 60 Months shelf life, this product offers extended usability windows. Proper storage at {Storage/Refrigeration Temperature} maintains the material's dielectric properties and application characteristics.To preserve optimal performance, store at 68°F ~ 77°F (20°C ~ 25°C) as recommended. This temperature range prevents component separation and maintains the material's thermal performance profile.