TH235-2-50G-2JAR

Penchem Technologies Sdn Bhd's TH235-2-50G-2JAR sets new benchmarks in Thermal - Adhesives, Epoxies, Greases, Pastes technology, specifically developed for mission-critical thermal management. This innovative formulation combines exceptional thermal transfer capabilities with robust mechanical stability, making it indispensable for next-generation electronic designs.Classified as Non-Silicone Putty, this thermal interface material exhibits unique self-leveling properties. Unlike standard compounds, its thixotropic behavior ensures optimal surface wetting while preventing pump-out effects in vibration-prone environments.The 50 gram Jar packaging configuration enables precise dispensing for automated assembly processes. This dimensional optimization reduces material waste by up to 30% compared to traditional packaging formats.Engineered to withstand 5°F ~ 248°F (-15°C ~ 200°C), this material demonstrates exceptional thermal stability. Its proprietary formulation prevents dry-out or cracking even after prolonged thermal cycling.Blue coloration provides immediate visual confirmation of proper application thickness. This chromatic feature is particularly valuable in high-density PCB assemblies where inspection access is limited.Delivering 4.00W/m-K thermal conductivity, this compound establishes new efficiency standards. Its advanced filler technology creates optimal thermal pathways while maintaining electrical insulation properties.The guaranteed 18 Months shelf life exceeds industry norms, reducing inventory turnover costs. When stored within {Storage/Refrigeration Temperature} parameters, the material maintains consistent performance characteristics.