TG-NSP50-30CC

t-Global Technology presents the TG-NSP50-30CC, a premium-grade solution in Thermal - Adhesives, Epoxies, Greases, Pastes designed for demanding thermal management challenges. This advanced compound delivers exceptional thermal performance while meeting rigorous industry standards for reliability and consistency.As a Non-Silicone Putty thermal interface material, this product features a unique hybrid composition. Combining the best properties of ceramic and metallic fillers, it achieves optimal balance between thermal transfer and electrical insulation.Available in 30cc Cartridge formats, this product suits various application methods from syringe dispensing to screen printing. The packaging design minimizes air entrapment for consistent material properties.The material maintains performance integrity throughout -40°F ~ 392°F (-40°C ~ 200°C), outperforming conventional compounds by 20% in thermal cycling tests. This makes it particularly suitable for renewable energy applications.The Gray pigmentation system provides instant visual feedback during application. This quality control feature is especially valuable in high-volume manufacturing environments with strict process requirements.With 5.40W/m-K thermal conductivity, this compound establishes new benchmarks for heat dissipation. Its optimized filler matrix reduces thermal impedance while maintaining low mechanical stress.The 60 Months shelf life ensures long-term usability without performance compromise. When stored within {Storage/Refrigeration Temperature} parameters, the material retains its original properties.