TE0782-02-82I33FA

The TE0782-02-82I33FA from Trenz Electronic GmbH represents a cutting-edge solution in the Embedded - Microcontroller, Microprocessor, FPGA Modules segment, engineered for high-performance embedded systems. This module combines advanced signal processing capabilities with robust power efficiency, making it ideal for 5G infrastructure and edge computing applications where low-latency operation is critical.Featuring a versatile MCU, FPGA architecture, this component delivers exceptional flexibility for multi-core processing tasks. When compared to conventional designs, its hybrid FPGA-MPU configuration enables superior parallel computation while maintaining precise clock synchronization across all cores.At the heart of the system lies the ARM Cortex-A9, optimized for real-time digital signal processing with its advanced pipeline architecture. The processor's instruction set acceleration ensures deterministic execution cycles, crucial for industrial automation timing constraints.The integrated Zynq-7000 (Z-7035) significantly enhances computational density, providing dedicated hardware acceleration for complex algorithms. This co-processing unit features adaptive voltage scaling to balance thermal dissipation with processing throughput in automotive ECUs.With 32MB of non-volatile memory, the device offers ample storage for firmware and configuration data. The flash memory subsystem incorporates error correction codes (ECC) to ensure data reliability in mission-critical aerospace applications.The 1GB high-speed memory supports demanding multi-threaded operations. Its low-latency access architecture is particularly effective for buffering high-bandwidth sensor data in autonomous driving systems.The Board-to-Board (BTB) Socket - 480 interface provides robust mechanical and electrical connections, developed for vibration-resistant industrial environments. Its impedance-matched design preserves signal quality even in extended cable runs common in factory automation.Measuring just 3.35" x 3.35" (85mm x 85mm), this compact form factor enables high-density installations. The precision-engineered package maintains thermal performance characteristics essential for medical imaging equipment.Rated for -40°C ~ 85°C, the module delivers reliable operation in extreme conditions. This temperature resilience, combined with conformal coating options, makes it suitable for outdoor IoT deployments in harsh climates.