SOMOMAP3530-11-1672IFXR

Engineered for next-generation automotive electronics, the SOMOMAP3530-11-1672IFXR by Beacon EmbeddedWorks redefines performance in the Embedded - Microcontroller, Microprocessor, FPGA Modules category. Its combination of functional safety features and high-speed processing makes it ideal for ADAS and autonomous vehicle perception systems.The MPU, DSP Core architecture provides automotive-grade reliability with its dual-core lockstep configuration. This fail-operational design exceeds ISO 26262 ASIL-D requirements for safety-critical vehicle systems.The ARM® Cortex®-A8, OMAP3530 delivers automotive-qualified performance with its temperature-compensated clock generation. Its superscalar architecture efficiently processes multiple sensor fusion algorithms simultaneously for comprehensive environment modeling.With the TMS320C64x (DSP) handling dedicated neural network acceleration, the module achieves unprecedented object detection speeds. This hardware acceleration is crucial for meeting the low-latency demands of autonomous emergency braking systems.Operating at 600MHz, the processor meets the real-time requirements of vehicle bus networks. The clock distribution network features automotive-grade jitter attenuation for reliable CAN FD and Automotive Ethernet communication.The 256MB (NAND), 8MB (NOR) flash memory supports over-the-air update capabilities with robust rollback protection. This secure storage solution is essential for complying with automotive cybersecurity standards like WP.29.128MB of error-correcting RAM ensures fault-tolerant operation of safety monitors. The memory subsystem's parity checking provides additional protection against single-event upsets in radiation-prone environments.The automotive-grade Board-to-Board (BTB) Socket - 240 interface meets USCAR vibration specifications. Its sealed design prevents moisture ingress in under-hood applications while maintaining signal integrity at high speeds.With dimensions of 1.23" x 3.01" (31.2mm x 76.5mm), the module fits within stringent automotive form factor requirements. The package's thermal design maintains performance during extended high-temperature operation in engine compartments.Qualified for -20°C ~ 70°C, the solution withstands the thermal extremes of electric vehicle power electronics. Extensive reliability testing ensures operation throughout the vehicle's lifespan.