TC4-2G

The TC4-2G by Chip Quik Inc. revolutionizes Thermal - Adhesives, Epoxies, Greases, Pastes applications through its scientifically formulated thermal management properties. Optimized for high-reliability systems, this material delivers unparalleled thermal transfer efficiency while simplifying manufacturing processes.This Silicone Compound thermal interface material incorporates nanotechnology-enhanced fillers. Compared to conventional formulations, it provides 25% better surface conformity while requiring 40% less application pressure for optimal bonding.Packaged in 2 gram Syringe quantities, this product accommodates diverse production scales. The ergonomic container design facilitates both manual application and automated dispensing systems.Performance remains stable across -40°F ~ 302°F (-40°C ~ 150°C), making it ideal for automotive under-hood applications. The material's thermal resistance coefficient shows less than 5% variation throughout this spectrum.The Silver hue serves multiple purposes: application verification and UV degradation monitoring. This dual-function pigmentation system enhances quality control in outdoor electronics applications.Achieving 79.00 W/m-K thermal conductivity, this material reduces thermal interface resistance by up to 35%. Its optimized particle distribution creates efficient heat transfer pathways without increasing mechanical stress.With 60 Months shelf life, this product offers extended usability windows. Proper storage at {Storage/Refrigeration Temperature} maintains the material's dielectric properties and application characteristics.To preserve optimal performance, store at 68°F ~ 77°F (20°C ~ 25°C) as recommended. This temperature range prevents component separation and maintains the material's thermal performance profile.