TC1-10G
Chip Quik Inc.
TC1-10G
Chip Quik Inc.
HEAT SINK COMPOUND - HIGH DENSIT
Reference Price (USD)
1+
$8.95000
500+
$8.8605
1000+
$8.771
1500+
$8.6815
2000+
$8.592
2500+
$8.5025
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
TC1-10G
$8.95
Product details
The TC1-10G by Chip Quik Inc. is a breakthrough in Thermal - Adhesives, Epoxies, Greases, Pastes, designed for ultra-high-frequency circuit applications. This precision component delivers exceptional signal integrity while minimizing insertion loss, making it indispensable for RF and microwave systems.As a Silicone Compound RF component, this device features patented impedance matching technology. When compared to conventional designs, its innovative architecture reduces return loss by up to 40% across {Frequency Range}.With compact 10 gram Syringe footprint, this component enables high-density PCB layouts. The space-saving design maintains strict dimensional tolerances for consistent RF performance in phased array applications.
Product Attributes
- Product Status: Active
- Type: Silicone Compound
- Size / Dimension: 10 gram Syringe
- Usable Temperature Range: -
- Color: White
- Thermal Conductivity: 0.67W/m-K
- Features: -
- Shelf Life: 60 Months
- Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
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