TC1-20G

The TC1-20G from Chip Quik Inc. represents a technological leap in Thermal - Adhesives, Epoxies, Greases, Pastes, specifically formulated for next-generation thermal management solutions. This high-performance material combines exceptional thermal transfer capabilities with outstanding reliability for mission-critical applications.This Silicone Compound thermal interface material incorporates advanced polymer technology. Unlike conventional compounds, its viscoelastic properties adapt to thermal expansion differentials, maintaining optimal interface pressure throughout {Usable Temperature Range}.The 20 gram Syringe packaging options cater to diverse manufacturing needs. Precision-engineered containers ensure consistent material properties from first to last use, reducing application variability.White coloration provides immediate visual confirmation of proper application. This quality assurance feature is particularly valuable in high-reliability applications where inspection access is limited.Delivering 0.67W/m-K thermal conductivity, this compound outperforms standard materials by 30-35%. Its optimized filler distribution creates efficient thermal pathways without compromising dielectric strength.With 60 Months shelf life, this product reduces material waste and inventory costs. Proper storage at {Storage/Refrigeration Temperature} maintains the compound's original performance characteristics.To preserve material integrity, maintain storage conditions at 37°F ~ 77°F (3°C ~ 25°C). This temperature control protocol prevents component separation and maintains optimal application properties.