TG-NSP35-1LB
t-Global Technology
TG-NSP35-1LB
t-Global Technology
THERMAL NON-SILICONE PUTTY 1LB
Reference Price (USD)
1+
$127.73000
500+
$126.4527
1000+
$125.1754
1500+
$123.8981
2000+
$122.6208
2500+
$121.3435
Exquisite packaging
Discount
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TG-NSP35-1LB
$127.73
Product details
The TG-NSP35-1LB by t-Global Technology is a breakthrough in Thermal - Adhesives, Epoxies, Greases, Pastes, designed for ultra-high-frequency circuit applications. This precision component delivers exceptional signal integrity while minimizing insertion loss, making it indispensable for RF and microwave systems.As a Non-Silicone Putty RF component, this device features patented impedance matching technology. When compared to conventional designs, its innovative architecture reduces return loss by up to 40% across {Frequency Range}.With compact 1 lb Can footprint, this component enables high-density PCB layouts. The space-saving design maintains strict dimensional tolerances for consistent RF performance in phased array applications.
Product Attributes
- Product Status: Active
- Type: Non-Silicone Putty
- Size / Dimension: 1 lb Can
- Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
- Color: Gray
- Thermal Conductivity: 3.50W/m-K
- Features: -
- Shelf Life: 60 Months
- Storage/Refrigeration Temperature: -
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