MPC8572ELPXAVNE557
Freescale Semiconductor
MPC8572ELPXAVNE557
Freescale Semiconductor
POWERQUICC RISC MICROPROCESSOR
Reference Price (USD)
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$342.61000
500+
$339.1839
1000+
$335.7578
1500+
$332.3317
2000+
$328.9056
2500+
$325.4795
Exquisite packaging
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MPC8572ELPXAVNE557
$342.61
Product details
The MPC8572ELPXAVNE557 by Freescale Semiconductor establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a PowerPC e500 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.5GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Signal Processing; SPE, Security; SEC neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR2, DDR3 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.10/100/1000Mbps (4) connectivity enables distributed AI processing across edge nodes with precise time synchronization.Designed with 1.5V, 1.8V, 2.5V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for 0°C ~ 105°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented Cryptography, Random Number Generator include model encryption and secure model update mechanisms for protected edge AI deployments.The 1023-BBGA, FCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 1023-FCBGA (33x33), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 1023-BBGA, FCBGA
- Supplier Device Package: 1023-FCBGA (33x33)
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