R8A774B0HA01BG#G0
Renesas Electronics America Inc
R8A774B0HA01BG#G0
Renesas Electronics America Inc
SOC RZ/G2N HDMI OFF
Reference Price (USD)
1+
$64.74589
500+
$64.0984311
1000+
$63.4509722
1500+
$62.8035133
2000+
$62.1560544
2500+
$61.5085955
Exquisite packaging
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R8A774B0HA01BG#G0
$64.75
Product details
Renesas Electronics America Inc's R8A774B0HA01BG#G0 sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The ARM® Cortex®-A57 architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 2 Core, 64-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 1.5GHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.Support for LPDDR4 memory technologies allows designers to optimize system cost and performance for specific application requirements.The No graphics subsystem enables smooth rendering of complex graphical user interfaces without external GPU components.Integrated DU interfaces support direct connection to modern display technologies, reducing BOM costs in HMI applications.10/100Mbps (1), 100/1000Mbps (1) connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.USB (2) implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.The 0.82V, 1.8V, 3.3V I/O banks offer design flexibility for interfacing with various peripheral devices in industrial control systems.Qualified for -40°C ~ 85°C (TA) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.The 1022-BGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 1022-FPBGA, the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A57
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: -
- RAM Controllers: LPDDR4
- Graphics Acceleration: No
- Display & Interface Controllers: DU
- Ethernet: 10/100Mbps (1), 100/1000Mbps (1)
- SATA: -
- USB: USB (2)
- Voltage - I/O: 0.82V, 1.8V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 1022-BGA
- Supplier Device Package: 1022-FPBGA
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