MCIMX6G2CVK05AB
NXP USA Inc.
MCIMX6G2CVK05AB
NXP USA Inc.
IC MPU I.MC6UL 528MHZ 272BGA
Reference Price (USD)
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$24.28000
500+
$24.0372
1000+
$23.7944
1500+
$23.5516
2000+
$23.3088
2500+
$23.066
Exquisite packaging
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MCIMX6G2CVK05AB
$24.28
Product details
The MCIMX6G2CVK05AB by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A7 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 528MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ SIMD neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The LPDDR2, DDR3, DDR3L memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting LCD, LVDS outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100Mbps (2) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 + PHY (2) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 105°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS include model encryption and secure model update mechanisms for protected edge AI deployments.The 272-LFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 272-MAPBGA (9x9), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 528MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: LCD, LVDS
- Ethernet: 10/100Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Package / Case: 272-LFBGA
- Supplier Device Package: 272-MAPBGA (9x9)
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