LS1026AXN8P1A
NXP USA Inc.
LS1026AXN8P1A
NXP USA Inc.
QORIQ LAYERSCAPE 2XA72 64BIT ARM
Reference Price (USD)
1+
$118.45917
500+
$117.2745783
1000+
$116.0899866
1500+
$114.9053949
2000+
$113.7208032
2500+
$112.5362115
Exquisite packaging
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LS1026AXN8P1A
$118.46
Product details
The LS1026AXN8P1A by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A72 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 64-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.4GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The DDR4 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.10GbE (2), 2.5GbE (1), 1GbE (4) connectivity enables distributed AI processing across edge nodes with precise time synchronization.SATA 6Gbps (1) interfaces provide high-speed storage for AI model repositories and inference datasets.The USB 3.0 (3) + PHY interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for -40°C ~ 105°C operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented Secure Boot, TrustZone® include model encryption and secure model update mechanisms for protected edge AI deployments.The 780-FBGA, FCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 780-FCPBGA (23x23), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.4GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
- SATA: SATA 6Gbps (1)
- USB: USB 3.0 (3) + PHY
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C
- Security Features: Secure Boot, TrustZone®
- Package / Case: 780-FBGA, FCBGA
- Supplier Device Package: 780-FCPBGA (23x23)
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