M2S090S-1FG676I

The M2S090S-1FG676I from Microsemi Corporation represents a cutting-edge solution in Embedded - System On Chip (SoC), engineered for high-performance embedded systems requiring precise signal processing. This SoC integrates advanced clock generation capabilities with robust thermal management, making it ideal for 5G infrastructure applications where signal integrity and low-latency operation are critical.Featuring an MCU, FPGA architecture, this component delivers exceptional processing efficiency while maintaining deterministic timing characteristics essential for real-time systems.With its ARM® Cortex®-M3 core, the device achieves optimal balance between computational throughput and power efficiency, enabling complex algorithm execution in power-constrained environments.The substantial 512KB flash memory accommodates extensive firmware libraries and real-time operating systems, providing developers with ample space for feature-rich applications.64KB of high-speed RAM ensures smooth multitasking performance, particularly beneficial for applications requiring rapid context switching and data buffering.Integrated peripherals including DDR, PCIe, SERDES offer designers unparalleled flexibility in system configuration, reducing BOM costs while enhancing I/O capabilities.Comprehensive CANbus, Ethernet, I²C, SPI, UART/USART, USB interfaces support seamless integration into heterogeneous networks, addressing the growing demand for interconnected industrial IoT solutions.Operating at 166MHz, the processor maintains exceptional timing precision critical for phase-sensitive applications like motor control and RF modulation.The FPGA - 90K Logic Modules configuration provides hardware-accelerated processing paths that significantly outperform software-based implementations in jitter-sensitive operations.Rated for -40°C ~ 100°C (TJ), this component maintains stable clock synchronization even in thermally challenging environments such as automotive engine compartments.The compact 676-BGA footprint enables high-density PCB layouts without compromising thermal dissipation or EMI performance.Available in 676-FBGA (27x27), the device supports automated pick-and-place assembly processes while ensuring reliable solder joint integrity.