A2F060M3E-FGG256M
Microsemi Corporation
A2F060M3E-FGG256M
Microsemi Corporation
IC SOC CORTEX-M3 80MHZ 256FBGA
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Product details
Engineered for next-generation automotive electronics, Microsemi Corporation's A2F060M3E-FGG256M redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making A2F060M3E-FGG256M the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MCU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the ARM® Cortex®-M3, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.128KB of automotive-qualified flash memory ensures secure storage for machine learning models and over-the-air update packages.With 16KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA, POR, WDT include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive EBI/EMI, I²C, SPI, UART/USART suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 80MHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for -55°C ~ 125°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 256-LBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 256-FPBGA (17x17), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Obsolete
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 128KB
- RAM Size: 16KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, I²C, SPI, UART/USART
- Speed: 80MHz
- Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
- Operating Temperature: -55°C ~ 125°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FPBGA (17x17)
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