M2S090-FGG676I
Microchip Technology
M2S090-FGG676I
Microchip Technology
IC SOC CORTEX-M3 166MHZ 676FBGA
Reference Price (USD)
1+
$291.85175
500+
$288.9332325
1000+
$286.014715
1500+
$283.0961975
2000+
$280.17768
2500+
$277.2591625
Exquisite packaging
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M2S090-FGG676I
$291.85
Product details
The M2S090-FGG676I from Microchip Technology delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making M2S090-FGG676I particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MCU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its ARM® Cortex®-M3 core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.512KB of non-volatile memory provides ample storage for firmware updates and energy production logging.The 64KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DDR, PCIe, SERDES include high-resolution PWM generators and isolated voltage/current sensing interfaces.The CANbus, Ethernet, I²C, SPI, UART/USART, USB options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 166MHz, the processor delivers the control bandwidth required for high-efficiency power conversion.FPGA - 90K Logic Modules include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for -40°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 676-BGA package provides excellent thermal dissipation for high-power applications.Available in 676-FBGA (27x27), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
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