TDA4VM88TGBALFR
Texas Instruments
Product details
The TDA4VM88TGBALFR from Texas Instruments delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making TDA4VM88TGBALFR particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid DSP, MCU, MPU architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 1.5MB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA, PWM, WDT include high-resolution PWM generators and isolated voltage/current sensing interfaces.The MCAN, MMC/SDSD/IOI²C, SPI, UART, USB options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 2GHz, 1GHz, 1.35GHz, 1GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Rated for -40°C ~ 105°C (TJ), the component maintains precision performance in outdoor solar installations.The 827-BFBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 827-FCBGA (24x24), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: DSP, MCU, MPU
- Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
- Flash Size: -
- RAM Size: 1.5MB
- Peripherals: DMA, PWM, WDT
- Connectivity: MCAN, MMC/SDSD/IOI²C, SPI, UART, USB
- Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Package / Case: 827-BFBGA, FCBGA
- Supplier Device Package: 827-FCBGA (24x24)