IBR210 HEATSINK
iBASE Technology
IBR210 HEATSINK
iBASE Technology
HEATSINK;HSIBR210-B V-A
Reference Price (USD)
1+
$14.14000
500+
$13.9986
1000+
$13.8572
1500+
$13.7158
2000+
$13.5744
2500+
$13.433
Exquisite packaging
Discount
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IBR210 HEATSINK
$14.14
Product details
iBASE Technology's IBR210 HEATSINK offers military-grade thermal solutions in the Thermal - Heat Sinks segment, specifically developed for aerospace and defense applications. This ruggedized design exceeds stringent military specifications while delivering exceptional thermal performance in extreme environments.The Board Level Vertical Extrusion configuration withstands 15g vibration per MIL-STD-810H. Unlike commercial designs, this variant maintains thermal contact under combined thermal and mechanical stress.Engineered for power modules in radar and avionics systems, the solution manages {Power Dissipation @ Temperature Rise} at 50,000ft altitude. The thermal interface maintains performance across -55 C to +125 C operational range.The Solderable Feet attachment meets IPC-CC-830 requirements for high-reliability soldering. The design survives 1000+ thermal cycles from -55 C to +125 C without joint degradation.Optimized 0.512" (13.00mm) ensures performance in thin-atmosphere conditions. The fin geometry is validated through computational fluid dynamics at 0.2atm pressure.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: IBR210
- Attachment Method: Push Pin
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: 0.512" (13.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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