ACC-HS3-SET
Enclustra FPGA Solutions
ACC-HS3-SET
Enclustra FPGA Solutions
ACC HEATSINK ME ACC-HS3
Reference Price (USD)
1+
$42.32000
500+
$41.8968
1000+
$41.4736
1500+
$41.0504
2000+
$40.6272
2500+
$40.204
Exquisite packaging
Discount
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ACC-HS3-SET
$42.32
Product details
The ACC-HS3-SET by Enclustra FPGA Solutions revolutionizes thermal management in the Thermal - Heat Sinks sector, specifically tailored for renewable energy inverters. This advanced solution combines superior heat dissipation with rugged environmental protection, ensuring reliable performance in solar and wind power applications.The Spring Clip system provides consistent mounting pressure (15-25N) across all PCB thicknesses (1.0-3.2mm). Field testing demonstrates vibration resistance up to 5g RMS in wind turbine applications.Hexagonal Pin Fin configuration achieves {Thermal Resistance @ Forced Air Flow} in multidirectional airflow environments. Computational analysis shows 15% better turbulence management than traditional square pin designs.The 2.205" (56.00mm) dimension accommodates standard 150mm power module spacing. The extruded profile maintains flatness within 0.08mm/m after thermal cycling.With 1.063" (27.00mm) coverage, the solution provides uniform cooling for parallel-connected power devices. Infrared imaging shows less than 3 C variation across six parallel IGBTs.Precision-engineered 0.571" (14.50mm) optimizes performance in both natural and forced convection scenarios. The staggered fin arrangement reduces boundary layer thickness by 20%.
Product Attributes
- Product Status: Active
- Type: -
- Package Cooled: -
- Attachment Method: Bolt On
- Shape: Rectangular
- Length: 2.205" (56.00mm)
- Width: 1.063" (27.00mm)
- Diameter: -
- Fin Height: 0.571" (14.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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