HSET950-BGA-2
iBASE Technology
HSET950-BGA-2
iBASE Technology
HEAT SPREADER FOR ET950 & ET960
Reference Price (USD)
1+
$25.25000
500+
$24.9975
1000+
$24.745
1500+
$24.4925
2000+
$24.24
2500+
$23.9875
Exquisite packaging
Discount
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HSET950-BGA-2
$25.25
Product details
iBASE Technology's HSET950-BGA-2 redefines thermal solutions in the Thermal - Heat Sinks segment, specifically developed for industrial automation systems. This thermally-optimized design incorporates innovative features that address heat management challenges in harsh operating conditions while ensuring long-term reliability.The Board Level Vertical configuration enables space-efficient thermal management in control cabinets. Unlike conventional top-mount designs, this orientation reduces PCB warpage risks by 30% during thermal cycling.Designed for power modules and TO-247 packages, the solution handles {Power Dissipation @ Temperature Rise} with margin for overload conditions. The thermal interface maintains stability across 50,000+ power cycles.
Product Attributes
- Product Status: Active
- Type: Heat Spreader
- Package Cooled: ET950, ET960
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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