1542264-4
TE Connectivity AMP Connectors
1542264-4
TE Connectivity AMP Connectors
SALEABLE PACKAGED VERSION.
Reference Price (USD)
1+
$9.50845
500+
$9.4133655
1000+
$9.318281
1500+
$9.2231965
2000+
$9.128112
2500+
$9.0330275
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
1542264-4
$9.51
Product details
TE Connectivity AMP Connectors's 1542264-4 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.For cylindrical heat pipes, the 1.375" (34.92mm) OD variant offers 6mm and 8mm options. The design maintains capillary performance at 45 tilt angles common in rack-mounted servers.Precision 0.471" (11.96mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: -
- Attachment Method: -
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 1.375" (34.92mm) OD
- Fin Height: 0.471" (11.96mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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