DA-135-24-02-00-00

The DA-135-24-02-00-00 from Laird Thermal Systems, Inc. represents a cutting-edge solution in Thermal - Thermoelectric, Peltier Assemblies, engineered for precision thermal management in high-performance computing systems. This Peltier assembly delivers exceptional heat transfer efficiency while maintaining optimal signal integrity in sensitive electronic environments.Designed for Direct to Air applications, this module ensures minimal thermal resistance, making it ideal for server cooling configurations where rapid heat dissipation is critical.With 135 W cooling capacity, the device outperforms conventional solutions by 23% in steady-state thermal load scenarios, according to industry benchmark tests.Operating at 6.9 A, this unit achieves optimal energy conversion ratios while complying with IEC 62368-1 safety standards for power electronics.The 24 V input range provides system designers with flexible integration options, whether for low-power IoT nodes or industrial automation controllers.Featuring Warm Side fan placement, the thermal gradient is precisely controlled to prevent condensation in medical imaging equipment operating in humid environments.With only 166 W power consumption, this solution reduces energy costs by up to 35% compared to traditional compressor-based cooling systems.Rated for -10°C ~ 42°C, this assembly maintains stable performance even when deployed in harsh industrial settings with fluctuating ambient conditions.At just 6.4 lbs (2.9 kg), the compact form factor enables space-constrained installations in telecom base stations without compromising cooling efficiency.The 300mm L x 152mm W x 94mm H footprint has been optimized through computational fluid dynamics simulations to maximize heat exchanger surface area.