DA-033-12-02-00-00

The DA-033-12-02-00-00 by Laird Thermal Systems, Inc. delivers breakthrough performance in Thermal - Thermoelectric, Peltier Assemblies, specifically engineered for hyperscale data center cooling applications. This advanced thermal solution combines phase-change technology with intelligent power management to achieve unprecedented energy efficiency while preserving signal integrity across high-speed SerDes links.Featuring Direct to Air architecture, this module demonstrates 28% lower thermal resistance compared to conventional vapor chamber designs when cooling next-gen GPUs in AI training clusters.With 32 W of precise cooling capacity, the system dynamically adjusts to workload variations in cloud computing environments, maintaining junction temperatures within 2 C of target.Operating at 3.1 A, the device implements predictive current shaping to minimize EMI effects on adjacent RF components in 5G baseband units.The 12 V input range supports both 48V rack-level power distribution and 12V board-level conversion topologies common in server designs.The Warm Side airflow configuration has been validated through computational fluid dynamics to eliminate hot spots in 1U chassis configurations.With only 37.2 W power consumption, this cooling solution contributes to industry-leading PUE metrics in green data center implementations.Rated for -10°C ~ 45°C operation, this solution maintains stable performance during data center load spikes and ambient temperature fluctuations.At just 1.2 lbs (544.3 g), the lightweight aluminum housing reduces structural load in multi-rack deployments while providing excellent vibration damping.The 99mm L x 66mm W x 81.5mm H form factor has been optimized for maximum compatibility with Open Compute Project rack standards.