CPU .63X.63
Bergquist
CPU .63X.63
Bergquist
THERM PAD 16MMX16MM TAN
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CPU .63X.63
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Product details
Bergquist's CPU .63X.63 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.Optimized for CPU applications, this thermal solution maintains stable performance under high-frequency switching conditions. Its low-inductance characteristics make it particularly suitable for RF power devices requiring minimal signal interference.As a premium Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Square configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 16.00mm x 16.00mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0050" (0.127mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The Tan coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.Delivering 0.6W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.
Product Attributes
- Product Status: Obsolete
- Usage: CPU
- Type: Pad, Sheet
- Shape: Square
- Outline: 16.00mm x 16.00mm
- Thickness: 0.0050" (0.127mm)
- Material: -
- Adhesive: -
- Backing, Carrier: -
- Color: Tan
- Thermal Resistivity: -
- Thermal Conductivity: 0.6W/m-K
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