CPU 1.375X1.375

Bergquist

General info

Part Number

CPU 1.375X1.375

Manufacturer

Bergquist

Description:

THERM PAD 34.93MMX34.93MM TAN

Datasheet:

CPU 1.375X1.375 PDF

Reference Price (USD)

$0.00000

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Exquisite packaging

Discount

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CPU 1.375X1.375

$0.00

Product details

Bergquist's CPU 1.375X1.375 establishes new standards in Thermal - Pads, Sheets for renewable energy systems. This high-efficiency thermal solution is engineered specifically for solar inverters and wind turbine power electronics, delivering unmatched reliability in green energy applications.Developed for CPU in renewable energy converters, this material withstands extreme outdoor conditions. Its UV-resistant formulation maintains thermal performance after 10,000+ hours of sunlight exposure, significantly outperforming conventional outdoor thermal interfaces.As an environmentally certified Pad, Sheet, this product combines superior thermal transfer with RoHS-compliant materials. The halogen-free composition makes it ideal for sustainable energy applications requiring eco-friendly components.Available in Square configurations, this solution accommodates large-area power modules. The precision-cut profiles ensure optimal coverage of IGBT and MOSFET packages in high-power converters.With 34.93mm x 34.93mm dimensions, this thermal pad fits standard renewable energy enclosure designs. The optimized footprint allows for efficient thermal pathway creation in space-constrained power cabinets.The carefully engineered 0.0050" (0.127mm) provides perfect balance between thermal transfer and vibration damping. This characteristic is particularly valuable in wind turbine applications subject to constant mechanical stress.The Tan identification system facilitates quick material verification during field maintenance. This outdoor-visible coloring remains legible even after years of environmental exposure.Achieving 0.6W/m-K performance, this material enables more efficient cooling of power semiconductors. The isotropic properties ensure uniform heat distribution across large-area devices.