ATS-HP-F6L300S13W-244

The ATS-HP-F6L300S13W-244 from Advanced Thermal Solutions Inc. represents cutting-edge thermal management technology in the Thermal - Heat Pipes, Vapor Chambers segment. Engineered for mission-critical applications, this solution delivers unparalleled heat dissipation efficiency through advanced phase-change mechanisms. With configurable form factors and military-grade materials, it ensures optimal thermal conductivity across demanding operating environments.Designed as a Heat Pipe, this component utilizes phase-change thermodynamics to achieve superior heat transfer rates compared to conventional solid conductors. Its dual-mode compatibility supports both vapor chamber and heat pipe configurations.Featuring multiple Epoxy or Solder options, the system accommodates diverse mounting requirements from high-vibration industrial setups to precision aerospace assemblies. The solder-attached variant demonstrates 40% higher shear strength than industry standards.The Flat geometry is optimized for maximizing surface contact area while minimizing airflow obstruction. Computational fluid dynamics simulations validate its 15% better thermal uniformity than competing profiles.Rated for 16.3W @ 300mm thermal loads, the solution handles transient heat spikes common in power electronics. The 150W capacity version supports overclocked CPU cooling at 95 C ambient.Incorporating Sintered capillary structures, the wicking mechanism achieves 0.25mm effective pore size for exceptional anti-gravity performance. Sintered copper variants exhibit 30% greater liquid return capacity.Available in 11.811" (300.00mm) dimensions, the scalable architecture supports thermal bridging across PCB layouts from compact IoT modules to server-grade component arrays. The 500mm version maintains <0.5 C/mm temperature gradient.Precision-engineered 0.339" (8.60mm) tolerances ensure seamless integration with high-density electronic packaging. The 11.20mm variant is specifically tuned for GPU VRM cooling applications.With z-axis profiles as slim as 0.079" (2.00mm), the low-profile design enables deployment in space-constrained embedded systems without compromising thermal performance.Stable across 30°C ~ 120°C ranges, the hermetic sealing prevents performance degradation in extreme environments. The -55 C variant is MIL-STD-810G compliant.Constructed from Copper alloys, the housing combines corrosion resistance with exceptional thermal diffusivity. Copper versions achieve 401 W/m K conductivity ratings.