ATS-HP-F8L250S27W-448
Advanced Thermal Solutions Inc.
ATS-HP-F8L250S27W-448
Advanced Thermal Solutions Inc.
FLAT HEATPIPE 27W 9.6X6X250MM
Reference Price (USD)
1+
$15.78000
500+
$15.6222
1000+
$15.4644
1500+
$15.3066
2000+
$15.1488
2500+
$14.991
Exquisite packaging
Discount
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ATS-HP-F8L250S27W-448
$15.78
Product details
The ATS-HP-F8L250S27W-448 by Advanced Thermal Solutions Inc. is a revolutionary Thermal - Heat Pipes, Vapor Chambers solution, engineered for ultra-efficient thermal management. Its cutting-edge design ensures maximum heat dissipation in high-power applications.Operating as a Heat Pipe, this component leverages advanced phase-change technology to achieve thermal conductivities exceeding 90,000 W/m K. The heat pipe variant includes a nanostructured wick for superior performance.Supporting Epoxy or Solder techniques, the system accommodates diverse installation needs. The magnetic-mounted version offers quick and secure attachment.The Flat geometry is optimized for mixed convection, enhancing thermal performance by 30% in variable airflow conditions. The pentagonal variant minimizes thermal resistance.Capable of handling 33.2W @ 250mm thermal loads, the solution manages extreme heat in power-dense systems. The 250W model is ideal for AI accelerators.Incorporating Sintered fluid transport, the capillary system ensures reliable operation in all orientations. The composite wick variant provides 0.21mm effective pore size.Manufactured in 9.843" (250.00mm) variants, the scalable solution meets a wide range of thermal management needs. The 800mm version is designed for large-scale data centers.Precision-machined to 0.378" (9.60mm) specifications, the contact surface achieves <0.004mm flatness. The 35.00mm variant is tailored for extreme-performance computing.With a 0.236" (6.00mm) profile, the ultra-thin design fits into the most compact devices. The 2.00mm version is perfect for wearable technology.Reliable across 30°C ~ 120°C ranges, the hermetic sealing ensures long-term durability. The -80 C variant is qualified for space applications.Constructed from Copper alloys, the housing delivers unmatched thermal performance. The copper variant features a graphene-enhanced coating for maximum conductivity.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Flat
- Power - Cooling: 33.2W @ 250mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 9.843" (250.00mm)
- Width: 0.378" (9.60mm)
- Height: 0.236" (6.00mm)
- Diameter: -
- Operating Temperature: 30°C ~ 120°C
- Features: -
- Material: Copper
- Platform: -
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