ATS-EXL113-1220-R0
Advanced Thermal Solutions Inc.
ATS-EXL113-1220-R0
Advanced Thermal Solutions Inc.
PCIE EXTRUSION PROFILE, AL6063
Reference Price (USD)
1+
$61.73000
500+
$61.1127
1000+
$60.4954
1500+
$59.8781
2000+
$59.2608
2500+
$58.6435
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
ATS-EXL113-1220-R0
$61.73
Product details
Advanced Thermal Solutions Inc.'s ATS-EXL113-1220-R0 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 48.032" (1220.00mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 1.575" (40.00mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 1.181" (30.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 4.50°C/W @ 200 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.The 10.00°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.
Product Attributes
- Product Status: Active
- Type: Top Mount, Extrusion
- Package Cooled: -
- Attachment Method: Adhesive
- Shape: Rectangular, Fins
- Length: 48.032" (1220.00mm)
- Width: 1.575" (40.00mm)
- Diameter: -
- Fin Height: 1.181" (30.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 10.00°C/W
- Material: Aluminum
- Material Finish: Degreased
You May Also Be Interested In