2227B
Aavid, Thermal Division of Boyd Corporation
2227B
Aavid, Thermal Division of Boyd Corporation
BOARD LEVEL HEAT SINK
Reference Price (USD)
1+
$8.14312
500+
$8.0616888
1000+
$7.9802576
1500+
$7.8988264
2000+
$7.8173952
2500+
$7.735964
Exquisite packaging
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Product details
The 2227B by Aavid, Thermal Division of Boyd Corporation revolutionizes thermal management in the Thermal - Heat Sinks sector, specifically tailored for renewable energy inverters. This advanced solution combines superior heat dissipation with rugged environmental protection, ensuring reliable performance in solar and wind power applications.The Top Mount Extruded design features optimized fin geometry that reduces thermal resistance by 22% compared to standard profiles. When subjected to IEC 60068-2-52 salt spray testing, the corrosion resistance exceeds 1000 hours.Designed for high-power IGBT modules, this solution handles {Power Dissipation @ Temperature Rise} in 85 C ambient conditions. The thermal interface maintains stability across 20,000+ power cycles, critical for solar farm operations.The Spring Clip system provides consistent mounting pressure (15-25N) across all PCB thicknesses (1.0-3.2mm). Field testing demonstrates vibration resistance up to 5g RMS in wind turbine applications.Hexagonal Pin Fin configuration achieves {Thermal Resistance @ Forced Air Flow} in multidirectional airflow environments. Computational analysis shows 15% better turbulence management than traditional square pin designs.For cylindrical busbar connections, the 0.315" (8.00mm) ID, 1.250" (31.75mm) OD variant offers 270 cooling coverage. The design withstands 300A continuous current without thermal derating.Precision-engineered 0.400" (10.16mm) optimizes performance in both natural and forced convection scenarios. The staggered fin arrangement reduces boundary layer thickness by 20%.Rated for 1.8W @ 50°C in outdoor environments, the design includes 25% margin for derating at 2000m altitude. Thermal models account for direct solar irradiation.Validated under UL 1741 standards, the 14.00°C/W @ 200 LFM remains stable in 95% relative humidity conditions. The design prevents condensation-induced performance degradation.The 21.00°C/W performance enables reliable operation during cooling fan failures. The design maintains critical components below 125 C in zero-airflow conditions for 45 minutes.Aluminum 6063-T6 alloy provides optimal balance between thermal conductivity (201 W/m K) and structural integrity. The material meets UL 94 V-0 flammability requirements.Gold Anodized surface treatment enhances corrosion resistance while improving radiative heat transfer by 12%. The finish withstands UV exposure per IEC 61215.
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-5
- Attachment Method: Press Fit
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 0.315" (8.00mm) ID, 1.250" (31.75mm) OD
- Fin Height: 0.400" (10.16mm)
- Power Dissipation @ Temperature Rise: 1.8W @ 50°C
- Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM
- Thermal Resistance @ Natural: 21.00°C/W
- Material: Aluminum
- Material Finish: Black Anodized