AT97SC3205T-G3M4600B

Microchip Technology

General info

Part Number

Manufacturer

Microchip Technology

Description:

PRODFF COM I2C TPM 4X4 32VQFN

Datasheet:

AT97SC3205T-G3M4600B PDF AT97SC3205T-G3M4600B Datasheet

Reference Price (USD)

$1.78000

500+

$1.7622

1000+

$1.7444

1500+

$1.7266

2000+

$1.7088

2500+

$1.691

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

AT97SC3205T-G3M4600B

$1.78

Product details

The AT97SC3205T-G3M4600B by Microchip Technology pioneers ultra-low-power design in Embedded - Microcontrollers - Application Specific, specifically developed for energy harvesting applications. This application-specific microcontroller operates down to 0.8V supply voltage, enabling battery-less IoT deployments with multi-year operation.Tailored for Trusted Platform Module (TPM) scenarios, the device includes nanowatt-range wake-up receivers. The energy-aware architecture achieves 98% duty cycle reduction through predictive sleep scheduling.Built around AVR technology, the CPU features subthreshold operation modes. The event-driven architecture consumes just 12 A/MHz during active processing.The EEPROM organization supports shadow register banking for zero-energy state retention. The non-volatile memory maintains data at 0V supply through ferroelectric technology.Featuring I²C connectivity, the device includes sub-1GHz RF frontends. Each communication peripheral implements adaptive impedance matching for energy-optimized transmission.With 4 ports, the GPIO subsystem features piezoelectric driver circuits. Configurable charge pumps enable direct energy harvesting from mechanical vibrations.Operating from 3.3V sources, the power management unit starts at 300mV input. The integrated maximum power point tracker optimizes energy extraction from solar cells.Rated for 0°C ~ 70°C operation, the device uses zero-leakage transistors. The package design minimizes thermal gradients that could affect energy harvesting efficiency.The Surface Mount configuration supports flexible PCB installations. The ultra-thin package enables integration into wearable form factors.The 32-VFQFN Exposed Pad option features transparent lids for solar cell integration. The package material selection maximizes light transmission to underlying photovoltaic layers.Available in 32-VQFN (4x4) format, each unit is tested with actual energy harvesting sources. Production includes verification of cold-start capability.