CYUSB3035-BZXC

Infineon Technologies's CYUSB3035-BZXC reimagines Embedded - Microcontrollers - Application Specific for smart grid and power conversion applications. This application-specific microcontroller integrates advanced PWM generation with high-resolution ADC capabilities, enabling precise control of power electronics.Optimized for USB Host/Peripheral Controller implementations, the device features hardware-based overcurrent protection with 50ns response time. The integrated sigma-delta modulators enable direct sensorless motor control.The ARM9® core includes dedicated trigonometric acceleration units. The parallel execution pipelines achieve 95% duty cycle accuracy at 100kHz switching frequencies.Supporting External Program Memory options, the flash memory incorporates shadow registers for bumpless firmware updates. The dual-plane architecture allows live updates during continuous operation.As a member of the CYUSB family, this device shares power library functions with related products. The consistent API simplifies migration between power stages.The 512K x 8 memory implements deterministic access timing for control loops. The dual-port architecture allows simultaneous access from CPU and PWM units.With GPIF, I²C, I²S, MMC/SD/SDIO, SPI, UART, USB connectivity, the device supports EtherCAT POWERLINK protocols. Each communication peripheral includes reinforced isolation meeting IEC 61800-5-1 standards.The 60 configurable ports feature 12-bit DAC outputs for analog control. Programmable dead-time insertion prevents shoot-through in bridge configurations.Operating from 1.15V ~ 1.25V inputs, the power architecture withstands 100V transients. The integrated gate drivers support SiC and GaN power devices.Certified for 0°C ~ 70°C operation, the package uses direct-bonded copper substrates. Thermal impedance is minimized for high-current applications.The Surface Mount option supports press-fit assembly for high-power PCBs. The package design accommodates thick copper layers for heat dissipation.Available in 121-TFBGA format, the package includes Kelvin sense connections. The low-inductance design minimizes switching losses at high di/dt rates.Supplied in 121-FBGA (10x10) configuration, each unit includes power cycling test reports. Production testing includes 100% burn-in at maximum junction temperature.