638-M15-332-BT4

EDAC Inc.

General info

Part Number

638-M15-332-BT4

Manufacturer

EDAC Inc.

Description:

638M SERIES VERTICAL D-SUB RECEP

Reference Price (USD)

$8.36797

500+

$8.2842903

1000+

$8.2006106

1500+

$8.1169309

2000+

$8.0332512

2500+

$7.9495715

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

638-M15-332-BT4

$8.37

Product details

The 638-M15-332-BT4 from EDAC Inc. sets the benchmark for high-reliability D-Sub Connectors in mission-critical applications. Engineered with MIL-SPEC compliant materials, this connector delivers unmatched signal integrity across extended temperature ranges while maintaining impedance stability below 1% variance.Designed for space-constrained applications, the D-Sub, High Density configuration ensures optimal PCB real estate utilization without compromising mating cycle durability (500+ cycles).Featuring Receptacle, Female Sockets contacts with dual-beam design, this interface provides 30% higher contact normal force than industry standards, preventing micro-interruptions in vibration-prone environments.The 15 contact arrangement supports hybrid power-signal distribution with isolated return paths, reducing crosstalk by 18dB compared to conventional layouts.With 3 precision-aligned rows, the contact pattern achieves 100% coplanarity compliance for zero-insertion-force mating requirements.The Free Hanging (In-Line) variant incorporates anti-rotation keying features that prevent misalignment during high-vibration operation (15G RMS random vibration tested).Optimized for EMI shielding effectiveness, the 1 (DE, E) High Density architecture provides 360 continuous shielding with <2 surface transfer impedance up to 6GHz.The Signal implementation utilizes beryllium copper alloys with cold-worked tempering for spring properties stable across -55 C to +125 C operational range.Board Side (4-40); Mating Side (4-40) mounting system enables tool-less installation with positive tactile engagement feedback, reducing assembly time by 40% versus threaded alternatives.The Solder Cup method employs gas-tight intermetallic bonds that exceed IPC-620 Class 3 requirements for military/aerospace applications.Steel, Tin Plated construction provides 96-hour salt spray resistance per ASTM B117 while maintaining <5m shell-to-shell conductivity.Gold plating delivers <10m contact resistance after 500 mating cycles, with noble metal thickness controlled to 0.05 m tolerance.Precision-controlled 15.0µin (0.38µm) deposition ensures fretting corrosion resistance exceeding 200 cycles per EIA-364-26 test protocol.The UL94 V-0 certified housing materials self-extinguish within 10 seconds after flame removal per UL94 vertical burn test.Derated for continuous operation, 5A capacity maintains <30 C temperature rise at 85% of maximum rated current.Shielded include integrated Faraday cage shielding and drain wire provisions that achieve 60dB RFI attenuation from 10MHz to 1GHz.