637-M62-632-BN6

EDAC Inc.

General info

Part Number

637-M62-632-BN6

Manufacturer

EDAC Inc.

Description:

637M SERIES VERTICAL D-SUB PLUG

Reference Price (USD)

$24.10800

500+

$23.86692

1000+

$23.62584

1500+

$23.38476

2000+

$23.14368

2500+

$22.9026

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

637-M62-632-BN6

$24.11

Product details

The 637-M62-632-BN6 by EDAC Inc. revolutionizes D-Sub Connectors performance in high-speed data center applications. Designed for 112G PAM4 signaling, this connector achieves <0.5dB insertion loss at 28GHz while maintaining 100 differential impedance within 5% tolerance.Featuring D-Sub, High Density architecture, the compact design enables 40% higher port density than traditional form factors without compromising thermal management capabilities.The Plug, Male Pins configuration implements edge-coupled differential pairs with controlled skew (<5ps) for precise timing alignment in SerDes applications.62 layout incorporates ground-stitching vias that reduce simultaneous switching noise by 22dB in 56Gbps NRZ applications.Precision-molded 3 dielectric body maintains <3% impedance variation across all channels for consistent signal integrity performance.The Free Hanging (In-Line) version features solder-tail alignment guides that ensure 0.1mm placement accuracy during reflow processes.Optimized for airflow management, 4 (DC, C) High Density design reduces pressure drop by 30% compared to conventional cage designs.Signal implementation uses phosphor bronze alloys with selective gold plating for optimal signal integrity and durability.The Housing/Shell (4-40) system incorporates thermal interface pads that improve heat dissipation by 25% in high-power applications.Our Solder Cup process creates solder joints that withstand 1000 thermal cycles from 0 C to +100 C without degradation.Steel, Nickel Plated construction provides 60dB EMI shielding effectiveness up to 40GHz for sensitive RF applications.The Gold surface treatment maintains <15m contact resistance after 10,000 mating cycles in dusty environments.Precision-controlled 30.0µin (0.76µm) ensures proper skin depth for high-frequency signal transmission up to 50GHz.All materials exceed UL94 V-0 requirements while maintaining low smoke generation (<15% opacity).The 5A per Contact design incorporates current-sharing topology that reduces joule heating by 40% at full load.Board Lock, Grounding Indents, Shielded include integrated retimer circuitry that compensates for up to 36dB channel loss at 56Gbps.