4668
Keystone Electronics
4668
Keystone Electronics
THERM PAD 13.97MM DIA
Reference Price (USD)
1+
$0.09910
500+
$0.098109
1000+
$0.097118
1500+
$0.096127
2000+
$0.095136
2500+
$0.094145
Exquisite packaging
Discount
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Product details
Keystone Electronics's 4668 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Round configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 13.97mm Dia sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0030" (0.076mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Mica formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Pad, Sheet
- Shape: Round
- Outline: 13.97mm Dia
- Thickness: 0.0030" (0.076mm)
- Material: Mica
- Adhesive: -
- Backing, Carrier: -
- Color: -
- Thermal Resistivity: -
- Thermal Conductivity: -