A10222-02
Laird Technologies - Thermal Materials
A10222-02
Laird Technologies - Thermal Materials
TPLI 240FG,A1 8X8IN
Reference Price (USD)
1+
$110.47000
500+
$109.3653
1000+
$108.2606
1500+
$107.1559
2000+
$106.0512
2500+
$104.9465
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
A10222-02
$110.47
Product details
Laird Technologies - Thermal Materials's A10222-02 establishes new standards in Thermal - Pads, Sheets for renewable energy systems. This high-efficiency thermal solution is engineered specifically for solar inverters and wind turbine power electronics, delivering unmatched reliability in green energy applications.As an environmentally certified Gap Filler Pad, Sheet, this product combines superior thermal transfer with RoHS-compliant materials. The halogen-free composition makes it ideal for sustainable energy applications requiring eco-friendly components.Available in Square configurations, this solution accommodates large-area power modules. The precision-cut profiles ensure optimal coverage of IGBT and MOSFET packages in high-power converters.With 203.20mm x 203.20mm dimensions, this thermal pad fits standard renewable energy enclosure designs. The optimized footprint allows for efficient thermal pathway creation in space-constrained power cabinets.The carefully engineered 0.0390" (0.991mm) provides perfect balance between thermal transfer and vibration damping. This characteristic is particularly valuable in wind turbine applications subject to constant mechanical stress.Constructed from weather-resistant Boron Nitride Filled, this pad exhibits exceptional performance in humid environments. The hydrophobic formulation prevents moisture absorption that could degrade thermal performance.Featuring Adhesive - One Side properties, this solution offers long-term bonding in variable temperatures. The temperature-resistant formulation maintains adhesion from -40 C to 150 C, covering all climatic conditions.Achieving 6.0W/m-K performance, this material enables more efficient cooling of power semiconductors. The isotropic properties ensure uniform heat distribution across large-area devices.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 203.20mm x 203.20mm
- Thickness: 0.0390" (0.991mm)
- Material: Boron Nitride Filled
- Adhesive: Adhesive - One Side
- Backing, Carrier: -
- Color: -
- Thermal Resistivity: -
- Thermal Conductivity: 6.0W/m-K
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